Dr. Paul L. Bergstrom
Dr. Paul L. Bergstrom
The scanning electron micrograph image at right shows a single electron transistor (SET) fabricated using focused ion beam (FIB) technology at Michigan Tech. operating at room temperature. This device represents a quantum dot-based device with sub-10nm quantum dots and an electrode spacing of 200nm. Details regarding this device were published in J. Appl. Physics in 2007.



Porous Silicon Technologies enabling Integrated Sensors and Actuators
Nanoscaled Technologies enabling Nanoelectronic Devices
Technologies for the Monolithic Integration of Sensors and Actuators with Electronics

Teaching


EE4240: Introduction to MEMS
EE5470: Semiconductor Fabrication Technologies
EE5480: Advanced MEMS
Integrated Microsystems Engineering Enterprise



Multi Scale Technologies Institute
Center for Integrated Systems for Sensing Imaging and Communications
NSF Engineering Research Center for Wireless Integrated Microsystems

contact


Michigan Technological University
Department of Electrical and Computer Engineering
121 EERC Bldg.
1400 Townsend Dr.
Houghton Michigan 49931
50 Things About Me
Dr. Bergstrom conducts research on the integration of nanoscaled technologies in complex microsystems. The research is focused in two areas: the physics and fabrication of devices and systems utilizing porous semiconductors, and the physics and fabrication of devices incorporating quantum scaled effects as long range extensions to mainstream VLSI CMOS technologies.
Dr. Bergstrom is an Associate Professor of Electrical and Computer Engineering, an Adjunct Associate Professor of Materials Science and Engineering, the Associate Director of the Multi Scale Technologies Institute, and the Faculty Director of the Microfabrication Facility at MTU.
The photo at left was taken during an educational outreach to a public school in the village of Barara, Haryana, India. I discussed science and engineering concepts and answered a lot of questions. The students primarily wanted to know how different it was to be a student in the United States. I am grateful for having been given the opportunity.
The photo at right shows a glimpse into Michigan Tech.’s Microfabrication Facility. The university has a modest fabrication capability for sample or wafer scale processing up to 150mm substrates of a wide variety of photonic, nanoscaled, bio-inspired, and microsystem research. This facility is part of a larger facility known as the Materials Characterization and Fabrication Facility.